Electronic Manufacturing Services
(ISO 9001:2000 Certified)

SoPark offers full turnkey and consignment-based orders for all your electronic needs. We are committed to high quality standards and excellent customer service. Our Program Management Teams will meet individual needs of each customer and deliver the best product available in a timely and friendly manner.

Board Assembly

• Surface mount technology.
• Continuous flow manufacturing.
• BGA, micro-BGA, fine-pitch.
• Rapid response prototype.
• Thru-hole
• Mixed technology
• Double-sided mixed technology
• Surface mount on flex
  
  

Test Capabilities

• Functional
• Genrad and MDA
• System test (hot mock-up)
• Temperature testing
• Humidity testing
• Board burn in capabilities
• Environmental stress screening
• X-Ray inspection

Board Assembly Tech Specs

• SMT packages placed: from 0402 to 2" x 2" size packages and 12 mil minimum pitch devices.
• SMT placements/month: 28 million
• Thru-hole placements/month: 2 million
• Maximum board width and length: 16" x 24"
• Typical run size: 25-10,000/month
• Quality system: based on ISO 9001:2000 and MIL Q-9858
• Workmanship: J-STD-001C, IPC-A-610C
• Materials procurement: full in-house procurement capabilities, turn-key, consignment, mixed

Cable and Electro-Mechanical

• Wire harness/cable assembly
• Power supply assembly
• Power supply test
• Cable/harness test continuity
• Cable/harness test strain
• Box build

Other Services

• Prototype assembly
• Module to final system assembly
• Ionic cleanliness testing
• In-house certified J-STD-001 instructor
• In-house certified IPC-A-610 instructor
• Custom test fixture design and build
  
• Thru hole to surface mount conversion
  
• Conformal coating, type UR, SR, AR
  
• Solderability testing to J-STD-002A